US 10,321,554 B2Granted

Electronic control unit

AssigneeMitsubishi Electric Corporation

InventorsYoshihito Asao, Akihiko Mori

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Abstract

The shape of an abutting portion where a heat sink and an electronic component or the heat sink and a connection wire abut against each other, through the intermediary of an intermediate member, is contrived so that there is provided an electronic control unit that can raise the easiness of production including the intermediate member, while securing the heat radiation performance. There is provided an electric power converter in which an intermediate member having an insulating property and a heat-conductive property is provided in a gap between a heat sink and a connection wire abutting portion or an electronic component, in which the top surface of a maximum heat generating component is a plane, and in which the portion, of the heat sink, that faces the top surface of the maximum heat generating component is part of a basic plane.

Claims9

Dependent claims

An electronic control unit comprising:

two or more electronic components that each generate heat when energized;
connection wires that connect the two or more electronic components;
and
a heat sink for radiating heat of the two or more electronic components and the connection wires,
wherein the two or more electronic components and the connection wires are mounted on a first substrate face that is one of the sides of a substrate,
wherein the heat sink is disposed spaced apart from a top surface, of each of the two or more electronic components and the connection wires, that is the surface opposite to the first substrate face,
wherein an intermediate member having an insulating property and a heat-conductive property is provided in a gap between the heat sink, and the two or more electronic components and connection wire abutting portions each of which is at least part of the connection wire in such a way as to abut against the heat sink, and the connection wire abutting portions or the two or more electronic components, and
wherein the top surface of a maximum heat generating component, which is an electronic component that generates heat most among the two or more electronic components when energized, is a plane;
a portion, of the heat sink, that faces the top surface of the maximum heat generating component is part of a basic plane, which is a plane of the heat sink, and
wherein the connection wires are provided with connection wire portion each of which is formed in a shape of a flat plate, and provided with the connection wire abutting portion which is provided with a heat-transfer protruding portion that is made of a material of a kind the same as the kind of the connection wire portions or a material having a heat-conductive property substantially the same as that of the connection wire portions, the heat-transfer protruding portion being formed in a shape of a flat plate protruding toward the heat sink from the connection wire portion, the heat-transfer protruding portion abutting against the intermediate member.

7 more elements

An electronic control unit comprising:

two or more electronic components that each generate heat when energized;
connection wires that connect the two or more electronic components;
and
a heat sink for radiating heat of the two or more electronic components and the connection wires,
wherein the two or more electronic components and the connection wires are mounted on a first substrate surface that is one of the sides of a substrate,
wherein the heat sink is disposed spaced apart from a top surface, of each of the two or more electronic components and the connection wires, that is the surface opposite to the first substrate surface,
wherein an intermediate member having an insulating property and a heat-conductive property is provided in a gap between the heat sink, and the two or more electronic components and connection wire abutting portions each of which is at least part of the connection wire in such a way as to abut against the heat sink, and the connection wire abutting portions or the two or more electronic components,
wherein the top surface of a maximum heat generating component, which is an electronic energized, is a plane;
a portion, of the heat sink, that faces the top surface of the maximum heat generating, component is part of a basic plane, which is a plane of the heat sink,
wherein the portion, of the heat sink, that faces the top surface of the connection wire abutting portion is a protruding portion that protrudes from the basic plain toward the connection wire abutting portion, and
wherein a front-end recess portion depressed toward the side opposite to the side of the connection wire abutting portion is formed in the front endface of the protruding portion;
the intermediate member is provided in the front-end recess portion.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/580,148Filed 5 Oct 2015
Published: US 2018/0206327 A119 Jul 2018
Granted: 11 Jun 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating
H10W 40/22
Arrangements for cooling: characterised by their shape, e.g. having conical or cylindrical projections

Family

US 2018/0206327 A1Pre-grant publication · published 19 Jul 2018
US 10,321,554 B2This patent

From the US filing history. Foreign family members aren’t listed.

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