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US 10,321,553 B2Granted
Shield to improve electromagnetic interference (EMI) suppression capability
AssigneeCisco Technology, Inc.
InventorsHailong Zhang, Xiaoxia Zhou, Jinghan Yu, Philippe Sochoux, Xiao Li, Alpesh Bhobe
Life of this patent
Estimating the term…
Abstract
An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.
Claims19
An electromagnetic interference (EMI) suppression apparatus comprising:
- a heat sink;
- an electrical component coupled to a first section of a bottom face of the heat sink;
- EMI absorbing material surrounding the electrical component, and directly affixed to a second section of the bottom face of the heat sink, wherein the second section of the bottom face of the heat sink and the first section of the bottom face of the heat sink are different sections of the bottom face of the heat sink;
- and
- electrically conductive material in contact with at least one side of the EMI absorbing material, the at least one side of the EMI absorbing material extending between the electrically conductive material and the electrical component,
- wherein,
- the EMI absorbing material includes a plurality of separate sections forming a rectangular shape that surrounds the electrical component, and an absorber corner tab disposed between each section of the plurality of separate sections to enclose the electrical component, and
- the absorber corner tab including a fastener to secure the electrical component to the heat sink.
5 more elements
A semiconductor device comprising:
- a heat sink;
- a printed circuit board having, an electrical component directly coupled to a first section of a bottom face of the heat sink;
- and
- an electromagnetic interference (EMI) suppression shield in contact with at least one of the printed circuit board or a second section of the bottom face of the heat sink,
- wherein,
- the second section of the bottom face of the heat sink and the first section of the bottom face of the heat sink are different sections of the bottom face of the heat sink,
- the shield includes electrically conductive material, and EMI absorbing material covered on at least one side by at least a portion of the electrically conductive material, the EMI absorbing material extending between the portion of the electrically conductive material and the electrical component,
- the EMI absorbing material includes a plurality of separate sections forming a rectangular shape that surrounds the electrical component, and an absorber corner tab disposed between each section of the plurality of separate sections to enclose the electrical component, and
- the absorber corner tab including a fastener to secure the electrical component to the heat sink.
6 more elements
An electromagnetic interference (EMI) suppressant shield comprising:
- a layer of EMI absorbing material disposed between a printed circuit board and a second section of a bottom face of a heat sink;
- an electrical component of the printed circuit board coupled to a first section of the bottom face of the heat sink, the first section of the bottom face of the heat sink and the second section of the bottom face of the heat sink are different sections of the bottom face of the heat sink;
- and
- conductive material disposed along at least a portion of the layer of EMI absorbing material, and extending between the printed circuit board and the heat sink,
- wherein
- the layer of EMI absorbing material includes a plurality of separate sections forming a rectangular shape that surrounds the electrical component, and an absorber corner tab disposed between each section of the plurality of separate sections to enclose the electrical component, and
- the absorber corner tab including a fastener to secure the printed circuit board to the heat sink.
4 more elements
Dependencies are inferred from the claim text.