Top port multi-part surface mount MEMS microphone

An acoustic component comprising:

• a substantially planar multilayer printed circuit board having first and second electrical interfaces, wherein the second electrical interface enables reflow solder attachment of the acoustic component to a user circuit board, the acoustic component comprising:
• a rigid top printed circuit board layer comprising a first non-conductive material layer with a first conductive layer disposed on an upper surface of the first non-conductive material layer, wherein the first conductive layer is patterned to form the first electrical interface comprising a plurality of conductive pads;
• a rigid bottom printed circuit board layer comprising a second non-conductive material layer with a second conductive layer disposed on a lower surface of the second non-conductive material layer, wherein the second conductive layer is pattered to form the second electrical interface comprising a plurality of flat solder pads, wherein the top and bottom printed circuit board layers are in facing relation to each other;
• a plurality of plated throughholes within the multilayer printed circuit board electrically coupling the plurality of conductive pads of the first interface to the plurality of flat solder pads of the second electrical interface;
• an acoustic port disposed in an interior region of the multilayer printed circuit board and passing completely through the multilayer printed circuit board, wherein one of the plurality of flat solder pads of the second electrical interface is a metal ring that completely surrounds the acoustic port in the multilayer printed circuit board;
• and
• a mounting region disposed along the periphery of the top printed circuit board layer;
• a micro-electro-mechanical system (MEMS) microphone die mounted to the upper surface of the top printed circuit board layer and electrically coupled to at least one of the conductive pads of the first electrical interface, the MEMS microphone die being disposed directly over the acoustic port in the multilayer printed circuit board;
• and
• a single-piece microphone die protection member;
• wherein the microphone die protection member is a solid material with a predetermined shape comprising a rectangular top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle, the sidewall portion supporting the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface;
• wherein the attachment surface of the sidewall portion of the microphone die protection member is aligned with and attached to the mounting region of the top printed circuit board layer;
• and
• wherein the predetermined height of the sidewall portion of the microphone die protection member, the interior sidewall surface of the sidewall portion of the microphone die protection member, and an interior surface of the top portion of the microphone die protection member, in cooperation with the upper surface of the top printed circuit board layer, provide a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.