LC composite electronic component, and mounting structure for LC composite electronic component

An LC composite electronic component, comprising:

• (a) a ceramic substrate that includes:
• (i) a magnetic layer;
• and
• (ii) an inductor element that is coil-shaped and is formed at least partly in the ceramic substrate;
• (b) a thin-film insulator layer located on a surface of the ceramic substrate, the thin-film insulating layer including a capacitor element that comprises:
• (i) a first capacitor electrode;
• (ii) a second capacitor electrode located closer to the ceramic substrate than the first capacitor electrode;
• (iii) a thin-film dielectric body at least part of which is located between the first and second capacitor electrodes;
• and
• (iv) an insulating resin layer which covers the capacitor element and has an exposed outer surface;
• and
• (c) external terminals located on the outer surface of the insulating resin layer, each respective external terminal being connected to the inductor element and/or the capacitor element.