Method of manufacturing elastic wave device

A method for manufacturing an elastic wave device comprising:

• a step of forming a plurality of functional element units and a connection line that electrically connects the plurality of functional element units on one principal surface of a motherboard having piezoelectricity;
• a step of forming a support layer made of resin that encloses the functional element units on the one principal surface of the motherboard;
• and
• a step of obtaining an elastic wave device having the functional element units by a step of dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line;
• wherein
• the connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected;
• the line main body and the connection unit are both formed in the step of forming the plurality of functional element units and the connection line;
• the step of dividing the multilayer body includes a step of dicing the multilayer body along the dicing line such that electrical connection between the connection unit and the line main body is broken;
• the connection unit is electrically connected to the line main body and the functional element units before the step of dicing the multilayer body;
• and
• the method further including a step of forming a retaining member made of resin which straddles the line main body in a width direction of the line main body and is separate from the support layer on the motherboard prior to dividing the multilayer body.