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US 10,320,145 B2Granted
Solder sealing in high-power laser devices
AssigneeTeradiode, Inc.
InventorsParviz Tayebati, Michael Deutsch
Life of this patent
Estimating the term…
Abstract
In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
Claims28
A method of sealing a laser apparatus, the method comprising:
- disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material;
- thereafter, depositing an electrically conductive sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount, wherein the thermal bonding material and the sealing material comprise different materials;
- and
- disposing a beam emitter in direct mechanical contact with the thermal bonding layer,
- wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.
2 more elements
A method of sealing a laser apparatus, the method comprising:
- disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material;
- disposing a beam emitter in direct mechanical contact with the thermal bonding layer;
- and
- after the thermal bonding layer is disposed over the surface of the electrode mount, and after the beam emitter is disposed in direct contact with the thermal bonding layer, depositing an electrically conductive sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount,
- wherein (i) the thermal bonding material and the sealing material comprise different materials, and (ii) at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.
2 more elements
A method of sealing a laser apparatus, the method comprising:
- disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material;
- thereafter, depositing an electrically conductive sealing material over an entirety of the thermal bonding layer and at least a portion of an external surface of the electrode mount;
- removing a portion of the sealing material to reveal an exposed portion of the thermal bonding layer;
- and
- disposing a beam emitter in direct contact with the exposed portion of the thermal bonding layer,
- wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.
3 more elements
A method of sealing a laser apparatus, the method comprising:
- disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material;
- disposing a beam emitter in direct contact with the thermal bonding layer;
- after the thermal bonding layer is disposed over the surface of the electrode mount, and after the beam emitter is disposed in direct contact with the thermal bonding layer, depositing an electrically conductive sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount;
- depositing the sealing material over at least a portion of the beam emitter;
- and
- removing at least a portion of the sealing material to reveal a portion of the beam emitter,
- wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.
4 more elements
Dependencies are inferred from the claim text.