High frequency BGA connector
AssigneeFci USA LLC
InventorsMadhumitha Rengarajan, Lewis Robin Johnson
Life of this patent
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AssigneeFci USA LLC
InventorsMadhumitha Rengarajan, Lewis Robin Johnson
Estimating the term…
A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.
A connector comprising:
An electrical connector comprising:
A method of manufacturing a connector comprising a housing comprising a surface, a plurality of contacts held by the housing, the plurality of contacts having mounting ends exposed adjacent the surface, wherein the mounting end of each of the plurality of contacts comprises a width in a direction parallel to the surface and an edge spanning the width of the mounting end, wherein the edge has a profile such that a length along the edge is longer than the width, the method comprising:
Dependencies are inferred from the claim text.