US 10,320,058 B2 · Portable electronic device and back cover assembly thereof

Abstract

The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Claims9

Dependent claims

A back cover assembly, comprising:

a substrate structure including a metal substrate and a first non-metal substrate connected with the metal substrate;
an insulation structure including a first insulation layer disposed on the metal substrate and the first non-metal substrate;
and
a coil structure surroundingly disposed on the first insulation layer to electrically connect to an IC chip;
wherein the coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed on the first insulation layer and above the metal substrate, the second coil portion is disposed on the first insulation layer and above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

2 more elements

A portable electronic device using a back cover assembly, characterized in that the back cover assembly comprises:

a substrate structure including a metal substrate and a first non-metal substrate connected with the metal substrate;
an insulation structure including a first insulation layer disposed on the metal substrate and the first non-metal substrate;
and
a coil structure surroundingly disposed on the first insulation layer to electrically connect to an IC chip;
wherein the coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed on the first insulation layer and above the metal substrate, the second coil portion is disposed on the first insulation layer and above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

2 more elements

Dependencies are inferred from the claim text.

Portable electronic device and back cover assembly thereof

Life of this patent

Portable electronic device and back cover assembly thereof

Life of this patent

Abstract

Claims9