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US 10,320,051 B2Granted
Heat sink for 5G massive antenna array and methods of assembling same
AssigneeIntel Corporation
InventorChia-Pin Chiu
Life of this patent
Estimating the term…
Abstract
A massive array antenna apparatus is configured with a cantilevered heat pipe that allows a semiconductive millimeter-wave device to move independently from a heat-sink base during thermal expansion and contraction.
Claims22
A heat-transfer apparatus, comprising:
- a heat-sink base including a heat-generating device mounting surface, a heat-pipe landing section set below the heat-generating device mounting surface, a cantilever ledge, and an access opening in the heat-sink base;
- a pedestal;
- a heat pipe including a pedestal section and a landing section that are separated by a cantilever section, wherein the heat pipe is physically attached to the pedestal at the pedestal section and physically attached to the heat-sink base at the heat-pipe landing section, wherein the heat pipe forms a cantilever at the cantilever ledge between the heat-pipe landing section and the pedestal section, and wherein the pedestal is suspended above the access opening.
A heat-transfer apparatus, comprising:
- a heat-sink base including a heat-generating device mounting surface, wherein the heat-generating device mounting surface is a printed wiring board (PWB) mounting surface, a heat-pipe landing section set below the heat-generating device mounting surface, a cantilever ledge, and an access opening in the heat-sink base, wherein the cantilever ledge is a cantilever step;
- a pedestal;
- a heat pipe including a pedestal section and a landing section that are separated by a cantilever section, wherein the heat pipe is physically attached to the pedestal at the pedestal section and physically attached to the heat-sink base at the heat-pipe landing section, wherein the heat pipe forms a cantilever at the cantilever ledge between the heat-pipe landing section and the pedestal section, and wherein the pedestal is suspended above the access opening;
- a recess set below the heat-pipe landing section and set apart from the heat-pipe landing section by the cantilever step;
- a printed wiring board (PWB) including a heat-sink base mounting surface that is assembled to the PWB mounting surface, a massive antenna array (MAA) mounting surface, and wherein the PWB includes a through hole through which the pedestal inserts;
- a massive antenna array (MAA) package substrate including a die side and an antenna-array side, wherein the MAA package substrate is mounted on the MAA mounting surface;
- an electrical bump array disposed on the MAA package substrate die side that surrounds the semiconductive mmWave device, wherein the electrical bump array is also disposed on the PWB;
- a millimeter-wave (mmWave) antenna array disposed on the antenna-array side;
- a semiconductive mmWave device including an active surface and a backside surface, wherein the semiconductive mmWave device is flip-chip mounted on the die side;
- wherein the pedestal is physically bonded to the backside surface;
- and
- a front enclosure that mates to the heat sink base and that exposes the mmWave antenna array.
9 more elements
A heat-transfer apparatus, comprising:
- a heat-sink base including a heat-generating device mounting surface, wherein the heat-generating device mounting surface is a printed wiring board (PWB) mounting surface, a heat-pipe landing section set below the heat-generating device mounting surface, a cantilever ledge, and an access opening in the heat-sink base, wherein the cantilever ledge is a cantilever step;
- a pedestal;
- a heat pipe including a pedestal section and a landing section that are separated by a cantilever section, wherein the heat pipe is physically attached to the pedestal at the pedestal section and physically attached to the heat-sink base at the heat-pipe landing section, wherein the heat pipe forms a cantilever at the cantilever ledge between the heat-pipe landing section and the pedestal section, and wherein the pedestal is suspended above the access opening;
- a recess set below the heat-pipe landing section and set apart from the heat-pipe landing section by the cantilever step;
- a printed wiring board (PWB) including a heat-sink base mounting surface that is assembled to the PWB mounting surface, a massive antenna array (MAA) mounting surface, and wherein the PWB includes a through hole through which the pedestal inserts;
- a massive antenna array (MAA) package substrate including a die side and an antenna-array side, wherein the MAA package substrate is mounted on the MAA mounting surface;
- an electrical bump array disposed on the MAA package substrate die side that surrounds the semiconductive mmWave device, wherein the electrical bump array is also disposed on the PWB;
- a millimeter-wave (mmWave) antenna array disposed on the antenna-array side;
- a semiconductive mmWave device including an active surface and a backside surface, wherein the semiconductive mmWave device is flip-chip mounted on the die side, wherein the pedestal is bonded to the semiconductive millimeter-wave device through a thermal interface material (TIM), wherein the TIM has a bond-line thickness (BLT) in a range from 20 micrometer (μm) to 50 μm;
- and
- wherein the pedestal is physically bonded to the backside surface.
8 more elements
Dependencies are inferred from the claim text.