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US 10,319,893 B2Granted
Magnetically guided chiplet displacement
AssigneeInternational Business Machines Corporation
InventorsStephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
Life of this patent
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Abstract
Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
Claims23
A method of forming a structure, the method comprising:
- providing, in any order, a first structure comprising a plurality of chiplets located on a surface of a temporary support substrate, and a second structure comprising a plurality of bond pads located on a surface of a receiving substrate;
- bringing the first and second structures into proximity to each other;
- and
- transferring a preselected number of chiplets of the first structure to the bond pads of the second structure utilizing magnetic force of attraction.
1 more element
A structure comprises:
- a first set of chiplets positioned on a first set of bond pads present on a display substrate, wherein a magnetic moment of a control orientation is present between each chiplet of the first set of chiplets and each bond pad of the first set of bond pads.
Dependencies are inferred from the claim text.