A method for manufacturing a light-emitting element mounting substrate, comprising:
- preparing a double-sided conductor substrate comprising a substrate comprising insulating resin, a first conductor layer formed on a first surface of the substrate, and a second conductor layer formed on a second surface of the substrate on an opposite side of the first surface;
- forming a plurality of positioning holes in the double-sided conductor substrate such that each of the positioning holes penetrates through the first conductor layer, the substrate and the second conductor layer;
- forming a plurality of holes in an element mounting portion of the first conductor layer such that each of the holes penetrates through the first conductor layer, the substrate and the second conductor layer and has a diameter that is larger than a diameter of each positioning hole;
- inserting a plurality of metal blocks into the plurality of holes respectively using the positioning holes as reference positions such that the metal blocks fill in the holes in the element mounting portion of the first conductor layer;
- and
- applying metal plating to the positioning holes such that a plurality of through-hole conductors is formed in the plurality of positioning holes respectively and electrically connects the first conductor layer and the second conductor layer,
- wherein the first conductor layer is formed such that when a light-emitting element is mounted on the element mounting portion, the plurality of metal blocks is positioned directly below the light-emitting element on the element mounting portion, each of the metal blocks has an end surface in a rectangular shape such that the diameter of each metal block is a diagonal length of the end surface in the rectangular shape, each of the through-hole conductors has an end surface in a circular shape such that the diameter of each through-hole conductor is a diameter of the end surface in the circular shape, the plurality of metal blocks and the plurality of through-hole conductors are formed such that a ratio of the diameter of the metal blocks to the diameter of the through-hole conductors is in a range of 1.5 to 7.5, the plurality of through-hole conductors is formed such that the diameter of the through-hole conductors is in a range of 0.2 mm to 1.0 mm, and the plurality of metal blocks is formed such that the diameter of the metal blocks is in a range of 0.3 mm to 4.0 mm.