Systems for adhesive bonding of electronic devices

A system for bonding a plurality of electronic components each to an electrically conductive connection point on a substrate via a conductive adhesive, the system comprising:

• an adhesive dispense station for dispensing conductive adhesive to adhere the electronic components to the electrically conductive connection points, the adhesive dispense station comprising a reservoir containing conductive adhesive;
• positioned to receive the electronic components and the substrate after dispensing of the conductive adhesive at the adhesive dispense station, a component placement station for placing the electronic components over the substrate with conductive adhesive between each electronic component and its corresponding connection point;
• and
• a bonding apparatus comprising:
• a platform for supporting the substrate;
• a reusable membrane for covering at least some of electronic components;
• a source of pressure for urging the membrane against the plurality of electronic components, whereby pressure is applied between each electronic component and its corresponding connection point with conductive adhesive therebetween;
• and
• a source of energy for at least partially curing the conductive adhesive without laminating or adhering any portion of the membrane to the substrate or to the electronic components, the source of energy comprising an array of individually addressable heating elements within the platform.