LED assembly for omnidirectional light appliances
AssigneesEpistar Corporation, Kaistar Lighting (Xiamen) Co., Ltd.
InventorsTzer-Perng Chen, Tzu-Chi Cheng
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Abstract
This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
Claims20
An LED assembly, comprising:
- a substrate comprising a first top surface;
- a mount, comprising a second top surface and a bottom surface which is opposite to the second top surface, wherein the mount is positioned on the first top surface in a configuration of forming a recess;
- a first LED chip, comprising a third top surface, and arranged on the first top surface and in the recess;
- a second LED chip formed in the recess;
- an electrode plate, comprising a fourth top surface, arranged on the second top surface, and electrically connected to the first LED chip;
- and
- a layer, comprising a phosphor, and covering the first LED chip, the second LED chip, the first top surface, and the electrode plate,
- wherein the fourth top surface is higher than the third top surface in an elevation from the first top surface.
An LED assembly, comprising:
- a substrate comprising a first top surface;
- a mount, comprising a second top surface and a bottom surface which is opposite to the second top surface, wherein the mount is positioned on the first top surface in a configuration of forming a recess;
- a glue layer arranged between the substrate and the mount;
- a first LED chip, comprising a third top surface, and arranged on the first top surface and in the recess;
- an electrode plate, comprising a fourth top surface, arranged on the second top surface, and electrically connected to the first LED chip;
- and
- a layer, comprising a phosphor, and covering the first LED chip, the first top surface, and the electrode plate,
- wherein the fourth top surface is higher than the third top surface in an elevation from the first top surface.
An LED assembly, comprising:
- a substrate comprising a first top surface;
- a mount, comprising a second top surface and a bottom surface which is opposite to the second top surface, wherein the mount is positioned on the first top surface in a configuration of forming a recess;
- a first LED chip, comprising a third top surface, and arranged on the first top surface and in the recess;
- an electrode plate, comprising a fourth top surface, arranged on the second top surface, and electrically connected to the first LED chip;
- and
- a layer having a curved surface, comprising a phosphor, and covering the first LED chip, the first top surface, and the electrode plate,
- wherein the fourth top surface is higher than the third top surface in an elevation from the first top surface.
Dependencies are inferred from the claim text.