Microelectronic workpiece processing systems and associated methods of color correction
AssigneeMicron Technology, Inc.
InventorsKevin Tetz, Charles M. Watkins
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Abstract
Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
Claims15
A system for processing a semiconductor substrate, comprising:
- a substrate support configured to individually carry a microelectronic workpiece containing a plurality of light emitting diodes (LEDs);
- a container holding a phosphor;
- an injector operatively coupled to the container, the injector being configured to introduce a volume of the phosphor onto the plurality of LEDs of the microelectronic workpiece;
- and
- a controller operatively coupled to the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising:
- receiving a base emission characteristic of the plurality of LEDs of the microelectronic workpiece;
- adjusting a characteristic of the phosphor based on a previously-performed measurement that generates a plurality of points in a chromaticity plot of the received base emission characteristic of the plurality of LEDs, and wherein each of the plurality of points is indicative of a set of parameters associated with the phosphor and the plurality of LEDs, and wherein the plurality of points together define a rectangular distribution area;
- and
- introducing the phosphor with the adjusted characteristic onto the plurality of LEDs.
A system for processing a semiconductor substrate, comprising:
- a substrate support configured to individually carry a microelectronic workpiece containing a plurality of light emitting diodes (LEDs);
- a container holding a phosphor;
- an injector operatively coupled to the container, the injector being configured to introduce a volume of the phosphor onto the plurality of LEDs of the microelectronic workpiece;
- and
- a controller operatively coupled to the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising:
- receiving a base emission characteristic of the plurality of LEDs of the microelectronic workpiece;
- developing a compensation scheme by selecting a group of candidate phosphors based on the base emission characteristic of the plurality of LEDs, wherein the group of the candidate phosphors is selected based on a previously-performed measurement that generates a plurality of points in a chromaticity plot of the received base emission characteristic of the plurality of LEDs, and wherein each of the plurality of points is indicative of a set of parameters associated with the phosphor and the plurality of LEDs, and wherein the plurality of points together define a rectangular distribution area;
- adjusting a characteristic of the phosphor based on the compensation scheme;
- and
- introducing the phosphor with the adjusted characteristic onto the plurality of LEDs.
Dependencies are inferred from the claim text.