Electronic component, manufacturing method of electronic component, and electronic equipment

An electronic component comprising:

• a base member;
• an electronic device fixed on the base member;
• and
• a lid member arranged over the electronic device and fixed on the base member,
• wherein a primary material of the lid member is a crystal quartz,
• wherein the lid member has two primary faces opposing to the electronic device and four side faces,
• wherein none of the four side faces is parallel to an optical axis of the crystal quartz, and
• wherein at least one of the four side faces is not perpendicular to the two primary faces.

A manufacturing method of a lid member of a package for mounting an electronic device, the manufacturing method comprising:

• preparing a crystal quartz plate having two primary faces and four side faces;
• and
• wet-etching the four side faces,
• wherein none of the four side faces is parallel to an optical axis of a crystal quartz.