Semiconductor devices including protruding insulation portions between active fins
AssigneeSamsung Electronics Co., Ltd.
InventorsShigenobu Maeda, Hee-Soo Kang, Sang-Pil Sim, Soo-Hun Hong
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AssigneeSamsung Electronics Co., Ltd.
InventorsShigenobu Maeda, Hee-Soo Kang, Sang-Pil Sim, Soo-Hun Hong
Estimating the term…
A semiconductor device can include a field insulation layer including a planar major surface extending in first and second orthogonal directions and a protruding portion that protrudes a particular distance from the major surface relative to the first and second orthogonal directions. First and second multi-channel active fins can extend on the field insulation layer, and can be separated from one another by the protruding portion. A conductive layer can extend from an uppermost surface of the protruding portion to cross over the protruding portion between the first and second multi-channel active fins.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.