Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

An imaging unit comprising:

• a back-illuminated semiconductor image sensor including a first substrate coupled to a second substrate, the first substrate including an image sensor and the second substrate including an image processing unit, wherein
• a first electrode and a second electrode are formed on a surface of the first substrate,
• a third electrode and a fourth electrode are formed on a surface of the second substrate,
• an intermediate layer is formed between the first substrate and the second substrate, the first electrode is electrically connected to the third electrode through the intermediate layer by a first conductive electrode formed in a first through-hole,
• the second electrode is electrically connected to the fourth electrode through the intermediate layer by a second conductive electrode formed in a second through-hole,
• the intermediate layer includes a heat dissipating unit, the heat dissipating unit is formed of a heat-conducting layer formed of a heat-conducting material, and
• the intermediate layer further includes a heat-insulating layer formed of a heat-insulative material, the heat-conducting layer is between the surface of the first substrate and the heat-insulating layer,
• wherein, within the first through-hole and the second through-hole, an insulative material is formed around the first conductive electrode and the second conductive electrode.