Electronic component including an optical member fixed with adhesive

An electronic component comprising:

• an electronic device;
• an optical member facing the electronic device in a first direction;
• and
• an adhesive member disposed between the optical member and a mount member to bond the optical member and the mount member together,
• wherein the optical member comprises a base material and a film disposed between the base material and the adhesive member,
• wherein the optical member further comprises a first region and a second region, the first region being disposed outside the second region in a second direction intersecting the first direction, the second region being constituted by the base material and the film, the first region being constituted by the base material, the first region and the second region constituting an interface with the adhesive member,
• wherein a length L1 of the first region in the second direction satisfies 0.1 mm≤L1<0.5 mm, and a length L2 of the second region in the second direction satisfies 0.5 mm ≤L2≤2.5 mm, and
• wherein an adhesive force generated at an interface between the first region and the adhesive member is less than or equal to 1.5 kg/mm2 and an adhesive force generated at an interface between the second region and the adhesive member is greater than or equal to 2.5 kg/mm2.

An electronic component comprising:

• an electronic device;
• a mount member to which the electronic device is fixed;
• an optical member facing the electronic device in a first direction;
• and
• a resin material disposed between the optical member and the mount member,
• wherein the optical member comprises a first region and a second region, the first region and the second region constituting an interface with the resin material,
• wherein the first region is disposed outside the second region in a second direction intersecting the first direction,
• wherein the optical member comprises glass made of either phosphate glass or fluorophosphate glass and a silicon oxide film, at least a part of the silicon oxide film is disposed between the phosphate or fluorophosphate glass and the resin material in the first direction, and
• wherein the interface between the second region and the resin material is constituted by the silicon oxide film, and the interface between the first region and the resin material is constituted by the phosphate or fluorophosphate glass, wherein the interface between the silicon oxide film of the second region and the resin material is wider in the second direction than the interface between the phosphate or fluorophosphate glass of the first region and the resin material.