Micro-LED module and method for fabricating the same

A method for fabricating a micro-LED module comprising:

• preparing a micro-LED comprising a plurality of electrode pads and a plurality of LED cells;
• preparing a submount substrate comprising a plurality of electrodes corresponding to the plurality of electrode pads;
• and
• flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes,
• wherein the micro-LED comprises a substrate and an epilayer comprising the LED cells,
• wherein the flip-bonding comprises heating the plurality of solders by a plurality of laser beams passing vertically through the micro-LED from one side to the other side of the micro-LED, and the plurality of laser beams comprise laser beams passing through the substrate and the epilayer in which none of the LED cells are present and laser beams passing through the substrate and the epilayer in which the LED cells are present.