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US 10,319,705 B2Granted
Elastomeric layer fabrication for light emitting diodes
AssigneeFacebook Technologies, LLC
InventorsDaniel Brodoceanu, Oscar Torrents Abad
Life of this patent
Estimating the term…
Abstract
An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (μLED) dies.
Claims20
A method, comprising:
- depositing a photoresist material on and between light emitting diode (LED) dies on a carrier substrate;
- applying light through the carrier substrate towards the LED dies and the deposited photoresist material, responsive to depositing the photoresist material;
- absorbing a portion of the light incident on the LED dies to retain soluble first portions of the photoresist material on the LED dies;
- exposing portions of photoresist material between the LED dies to another portion of the light to render second portions of the photoresist material between the LED insoluble;
- removing the first portions of photoresist material, responsive to applying the light;
- depositing an elastomeric material on each LED die and between the second portions of photoresist, responsive to removing the first portions;
- and
- removing the second portions of the photoresist material responsive to depositing the elastomeric material, the elastomeric material forming elastomeric interface layers on the LED dies.
5 more elements
A method, comprising:
- depositing a photoresist material on and at side surfaces of a light emitting diode (LED) die on a carrier substrate;
- applying light through the carrier substrate towards the LED die and the deposited photoresist material, responsive to depositing the photoresist material;
- absorbing a portion of the light incident on the LED die to retain a soluble first portion of the photoresist material on the LED die;
- exposing portions of photoresist material at the side surfaces of the LED die to another portion of the light to render second portions of the photoresist material at the side surfaces of the LED insoluble;
- removing the first portion of photoresist material, responsive to applying the light;
- depositing an elastomeric material on the LED die and between the second portions of photoresist, responsive to removing the first portion;
- and
- removing the second portions of the photoresist material responsive to depositing the elastomeric material, the elastomeric material forming elastomeric interface layer on the LED die.
5 more elements
An electronic display panel fabricated by a method, comprising:
- depositing a photoresist material on and between light emitting diode (LED) dies on a carrier substrate;
- applying light through the carrier substrate towards the LED dies and the deposited photoresist material, responsive to depositing the photoresist material;
- absorbing a portion of the light incident on the LED dies to retain soluble first portions of the photoresist material on the LED dies;
- exposing portions of photoresist material between the LED dies to another portion of the light to render second portions of the photoresist material between the LED insoluble;
- removing the first portions of photoresist material, responsive to applying the light;
- depositing an elastomeric material on each LED die and between the second portions of photoresist, responsive to removing the first portions;
- removing the second portions of the photoresist material responsive to depositing the elastomeric material, the elastomeric material forming elastomeric interface layers on the LED dies
- picking up at least a portion of the LED dies on the carrier substrate by attaching a non-conformable pick-up head to the elastomeric interface layers over the LED dies;
- and
- placing the at least a portion of the LED dies attached to the non-conformable pick-up head on a display substrate defining pixel control circuits of an electronic display.
7 more elements
Dependencies are inferred from the claim text.