Microelectronic device package having alternately stacked die
AssigneeIntel Corporation
InventorsBok Eng Cheah, Min Suet Lim, Jackson Chung Peng Kong
Life of this patent
Estimating the term…
Abstract
A microelectronic device package including multiple layers of stacked die. Multiple die layers in the package can include two or more die. At least two die in a first layer will be laterally spaced from one another to define a first gap extending in a first direction; and at least two die in a second layer will be laterally spaced from one another to define a second gap extending in a second direction that is angularly offset from the first direction. The first and second directions can be perpendicular to one another.
Claims15
A microelectronic device, comprising:
- a substrate;
- first and second semiconductor die supported by the substrate in laterally spaced relation to one another defining a first gap extending in a first direction;
- third and fourth semiconductor die extending over the first and second semiconductor die and in laterally spaced relation to one another defining a second gap extending in a second direction angularly offset from the first direction of the first gap;
- and
- fifth and sixth semiconductor die extending over the third and fourth semiconductor die and in laterally spaced relation to one another defining a third gap extending in a third direction angularly offset from the second direction, wherein the third direction and the first direction are the same.
A microelectronic device, comprising
- a substrate;
- and
- multiple layers of semiconductor die supported by the substrate, the multiple layers including,
- first and second layers that each include at least two die in spaced relation to one another to define a respective gap between the die, and
- a third layer of semiconductor die above the second layer of the multiple layers, the third layer of semiconductor die including at least two die in spaced relation to one another to define a gap between such die;
- and
- wherein the gap between die in the first layer extends in a first direction, wherein the gap between die in the second layer extends in a second direction angularly offset from the first direction, and wherein the gap between the at least two die in the third layer extends in the first direction.
An electronic system, comprising:
- a microelectronic device, comprising,
- a substrate,
- a first semiconductor die layer including first and second semiconductor die supported by the substrate in laterally spaced relation to one another defining a first gap extending in a first direction,
- a second semiconductor die layer including third and fourth semiconductor die extending over the first and second semiconductor die and in laterally spaced relation to one another defining a second gap extending in a second direction perpendicular to the first direction of the first gap;
- a third semiconductor die layer including fifth and sixth semiconductor die extending over the third and fourth semiconductor die and in laterally spaced relation to one another defining a third gap extending in the first direction;
- and
- at least one of a mass storage device and a network interface operably coupled to the microelectronic device.
Dependencies are inferred from the claim text.