Transferring method, manufacturing method, device and electronic apparatus of micro-LED

A method for transferring micro-LEDs, comprising:

• forming micro-LEDs on a laser-transparent original substrate;
• providing an anisotropic conductive layer on a receiving substrate;
• bringing the micro-LEDs into contact with the anisotropic conductive layer on the receiving substrate;
• irradiating the laser-transparent original substrate with laser from an original substrate side to lift-off the micro-LEDs from the laser-transparent original substrate;
• and
• processing the anisotropic conductive layer, to electrically connect the micro-LEDs via the anisotropic conductive layer on the receiving substrate,
• wherein processing the anisotropic conductive layer further comprises:
• applying pressure on the anisotropic conductive layer from a micro-LED side by using an auxiliary substrate, a surface of the auxiliary substrate being coated with a temporary bonding polymer,
• bonding the auxiliary substrate with the anisotropic conductive layer via the temporary bonding polymer;
• and
• after applying the pressure, de-bonding the auxiliary substrate via the temporary bonding polymer, to remove the auxiliary substrate.