Semiconductor assembly and method of making same

A device comprising:

• a package substrate, the package substrate comprises a first side;
• a first means for connection directly coupled to the first side of the package substrate along a perimeter of the package substrate, the first means configured to electrically couple the package substrate to a printed circuit board opposite the package substrate;
• a second means for connection directly coupled to the first side of the package substrate between the first means for connection;
• a first set of contacts on the second means for connection opposite the first side of the package substrate;
• a semiconductor die, the semiconductor die comprises an active side, a back side opposite the active side;
• a plurality of vias configured to couple the active side to the back side and configured to transfer heat from the active side to a third means for connection, each of the plurality of vias tapered in a straight line from a wide portion proximate to the back side to a narrow portion proximate the active side, and wherein the active side of the semiconductor die is directly coupled to the first set of contacts opposite the second means for connection;
• and
• a second set of contacts coupled to the back side wherein at least one of the second set of contacts connects to two or more of the plurality of vias;
• wherein the third means for connection is coupled to the second set of contacts and the printed circuit board and forms a land grid array.

A device comprising:

• a package substrate, the package substrate comprises a first side;
• first means for connection directly coupled to the first side of the package substrate along a perimeter of the package substrate, the first means for connection configured to electrically couple the package substrate to a printed circuit board opposite the package substrate;
• second means for connection directly coupled to the first side of the package substrate between the first means for connection;
• a first set of contacts on the second means for connection opposite the first side of the package substrate;
• a semiconductor die, the semiconductor die comprises an active side, a back side opposite the active side, and wherein the active side of the semiconductor die is directly coupled to the first set of contacts opposite the second means for connection;
• means for heat transfer connected between the first set of contacts and a second set of contacts, the means for heat transfer configured to transfer heat from the active side of the semiconductor die to a third means for connection, each of the means for heat transfer tapered in a straight line from a wide portion proximate to the back side to a narrow portion proximate the active side;
• and
• the second set of contacts coupled to the back side wherein at least one of the second set of contacts connects to two or more means for heat transfer;
• wherein the third means for connection is coupled to the second set of contacts and the printed circuit board and forms a land grid array.

A method for manufacturing a device, comprising:

• forming a package substrate;
• forming a plurality of first solder balls directly on a first side of the package substrate along a perimeter of the package substrate, the plurality of first solder balls configured to electrically couple the package substrate to a printed circuit board opposite the package substrate;
• forming a plurality of second solder balls directly on the first side of the package substrate between the plurality of first solder balls;
• forming a first set of contacts on the plurality of second solder balls and attaching a semiconductor die to the first set of contacts;
• forming a plurality of vias in the semiconductor die, wherein the plurality of vias are configured to transfer heat from an active side of the semiconductor die to a back side of the semiconductor die, each of the plurality of vias tapered in a straight line from a wide portion proximate to the back side to a narrow portion proximate the active side and wherein the active side of the semiconductor die is directly coupled to the first set of contacts opposite the plurality of second solder balls;
• forming a second set of contacts on the back side, wherein at least two of the plurality of vias are connected to one of the second set of contacts;
• and
• forming a plurality of solder prints on the back side configured to connect to the printed circuit board and form a land grid array.