Solderless interconnection structure and method of forming same

A method of forming a semiconductor device, the method comprising:

• forming a first conductive element on a first substrate, a first width of the first conductive element decreasing as the first conductive element extends away from the first substrate;
• forming an under bump metallurgy (UBM) on a contact element of an integrated circuit;
• forming a second conductive element on the UBM, a second width of the second conductive element decreasing as the second conductive element extends away from the integrated circuit, wherein the first width of the first conductive element at a first distal end from the first substrate is less than the second width of the second conductive element at a second distal end from the integrated circuit;
• aligning the first conductive element with the second conductive element;
• and
• bonding the first conductive element to the second conductive element without using solder.