Semiconductor structure and manufacturing method thereof

A semiconductor structure, comprising:

• a semiconductive substrate;
• a via extended through at least a portion of the semiconductive substrate;
• an interconnect structure disposed over the semiconductive substrate and including a dielectric layer, a first transmission electrode disposed within the dielectric layer and a first receiving electrode disposed within the dielectric layer;
• a waveguide disposed within the dielectric layer and in contact with the first transmission electrode and the first receiving electrode;
• a transmission die disposed over the interconnect structure and including a transmission circuit electrically connected to the first transmission electrode;
• and
• a receiving die disposed over the interconnect structure and including a receiving circuit electrically connected to the first receiving electrode,
• wherein the via is electrically connected to the first transmission electrode or the first receiving electrode, the waveguide is electrically connected to the via through the first transmission electrode or the first receiving electrode, the transmission circuit is configured to generate an electrical signal, the receiving circuit is configured to receive the electrical signal, the electrical signal is convertible to an electromagnetic signal transmittable from the first transmission electrode to the first receiving electrode within the waveguide.

A semiconductor structure, comprising:

• a semiconductive substrate;
• a dielectric layer over the semiconductive substrate;
• a first conductive member and a second conductive member disposed within the dielectric layer;
• a third conductive member and a fourth conductive member disposed within the dielectric layer and below the first conductive member and the second conductive member;
• a waveguide disposed within the dielectric layer, an end of the waveguide disposed between and in contact with the first conductive member and the third conductive member, and another end of the waveguide disposed between and in contact with the second conductive member and the fourth conductive member;
• and
• a via extended through at least a portion of the semiconductive substrate and electrically connected to the first conductive member or the second conductive member;
• wherein the waveguide is coupled with the first conductive member and the second conductive member to transmit an electromagnetic signal from the first conductive member to the second conductive member, and the via is electrically connected to the waveguide through the first conductive member or the second conductive member.