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US 10,319,689 B2Granted
Antenna assembly for wafer level packaging
AssigneeNXP USA, Inc.
InventorsWeng Foong Yap, Jinbang Tang
Life of this patent
Estimating the term…
Abstract
Embodiments are provided for a packaged semiconductor device that includes a package substrate that in turn includes an embedded die configured to process a radio frequency (RF) signal; a printed circuit board (PCB) attached to a front side of the package substrate, where the PCB includes a cavity; and an antenna enabling element attached to the front side of the package substrate within the cavity, the antenna enabling element configured to convey the RF signal through the cavity.
Claims22
A radio frequency (RF) semiconductor device comprising:
- a package substrate comprising:
- an embedded die configured to process a radio frequency (RF) signal, and
- embedded interconnects between an active side of the embedded die and a front side of the package substrate, wherein the embedded interconnects have contact areas exposed at the front side of the package substrate;
- a printed circuit board (PCB) having a first side and a second side that opposes the first side, wherein the PCB includes a cavity that extends from the first side to the second side of the PCB,
- wherein the first side of the PCB is attached to the front side of the package substrate by a plurality of solder connections that are attached to a first subset of the contact areas of the embedded interconnects exposed at the front side of the package substrate, and
- wherein the PCB is configured to:
- provide ground to the embedded die through a first solder connection of the plurality of solder connections, and
- provide a power supply voltage to the embedded die through a second solder connection of the plurality of solder connections;
- and
- an antenna enabling element attached to the front side of the package substrate within the cavity, the antenna enabling element configured to convey the RF signal through the cavity between the first side and the second side of the PCB.
7 more elements
A packaged semiconductor device comprising:
- an integrated circuit die embedded in a package body, wherein the integrated circuit die has an active side exposed in a top surface of the package body, the integrated circuit die is configured to process a radio frequency (RF) signal;
- a plurality of buildup layers over and contacting the active side of the integrated circuit die and the top surface of the package body, wherein the plurality of buildup layers form a plurality of embedded interconnects to the integrated circuit die, wherein the plurality of embedded interconnects have contact areas exposed at a top buildup layer;
- an antenna enabling element attached to a first subset of contact areas;
- and
- a printed circuit board (PCB) having a first side attached a second subset of contact areas by a plurality of solder connections,
- wherein the PCB is configured to:
- provide ground to the integrated circuit die through a first solder connection of the plurality of solder connections, and
- provide a power supply voltage to the integrated circuit die through a second solder connection of the plurality of solder connections,
- wherein at least a portion of the PCB is located laterally to the antenna enabling element, and the antenna enabling element is configured to convey the RF signal between the first side of the PCB and a second side of the PCB that opposes the first side.
6 more elements
Dependencies are inferred from the claim text.