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US 10,319,688 B2Granted
Antenna on ceramics for a packaged die
AssigneeIntel Corporation
InventorsAndreas Wolter, Saravana Maruthamuthu, Mikael Knudsen, Thorsten Meyer, Georg Seidemann, Pablo Herrero, Pauli Jaervinen
Life of this patent
Estimating the term…
Abstract
An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.
Claims18
A package comprising:
- a die;
- a dielectric ceramic substrate over the die, the ceramic substrate having a thickness of at least 10 micrometers, wherein the dielectric ceramic substrate has a first surface facing the die, a second surface facing away from the die, and a sidewall surface connecting the first surface to the second surface;
- an antenna formed on the second surface of the ceramic substrate, wherein the antenna is positioned over the die, the antenna being positioned such that the dielectric of the ceramic increases the resonant frequency of the antenna;
- a conductive shield layer between the first surface of the ceramic substrate and the die;
- conductive leads electrically connecting the antenna to the die;
- and
- a mold compound over the die and completely covering the sidewall surface of the ceramic substrate.
4 more elements
A computing system comprising:
- a processor;
- a user interface;
- and
- a communications chip in a package, the package having a die, a dielectric ceramic substrate over the die, the ceramic substrate being a having a thickness of at least 10 micrometers, wherein the dielectric ceramic substrate has a first surface facing the die, a second surface facing away from the die, and a sidewall surface connecting the first surface to the second surface, an antenna formed on the second surface of the ceramic substrate, the antenna being positioned such that the dielectric of the ceramic increases the resonant frequency of the antenna, a conductive shield layer between the first surface of the ceramic substrate and the die, a mold compound over the die and completely covering the sidewall surface of the ceramic substrate, a redistribution layer formed on a front side of the die and on the mold compound and conductive leads electrically connecting the antenna to the redistribution layer.
1 more element
A method comprising:
- forming a dielectric ceramic substrate with a thickness of at least 10micrometers, wherein the dielectric ceramic substrate has a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface;
- attaching an antenna to the second surface of the ceramic substrate, the antenna being attached such that the dielectric of the ceramic increases the resonant frequency of the antenna;
- applying a conductive shield layer on the first surface of the ceramic substrate;
- attaching the ceramic substrate to a die, wherein the first surface of the ceramic substrate is facing the die, and the second surface of the ceramic substrate is facing away from the die;
- forming a cover over the die and completely covering the sidewall surface of the ceramic substrate;
- forming a redistribution layer over the cover and the die;
- and
- electrically connecting the antenna to the die through the redistribution layer.
5 more elements
Dependencies are inferred from the claim text.