EMI shielded integrated circuit packages and methods of making the same

An electromagnetic interference shielded integrated circuit package, comprising:

• a circuit module having first and second opposing surfaces;
• a series of contiguous conductive spacers disposed on at least one of said surfaces;
• a conductive plane sandwiched between said surfaces;
• a plurality of spaced electrical component sections being separated by said conductive spacers;
• first shielding means disposed beneath and adjacent to said respective spaced electrical component sections;
• an interposer having a plurality of conductive cavities on a recessed top surface;
• a conduction pattern disposed on a bottom opposing surface of said interposer;
• a series of contiguous conductive ridges positioned in between each adjacent said cavities;
• second shielding means disposed on at least one of the interior surfaces of said conductive cavities and adjacent said respective conductive cavities;
• wherein said circuit module is mounted over said interposer,
• said spaced electrical component sections are disposed inside a space of said respective conductive cavities,
• said conductive plane is electrically coupled to said conductive spacers,
• said conductive spacers, from a top-down perspective, overlaps and are electrically coupled to said respective conductive ridges so that said first shielding means is disposed over and electrically coupled to said respective second shielding means and thereby forms a plurality of closed electromagnetic interference shielded enclosures for holding said respective spaced electrical component sections therein, and
• wherein said electromagnetic interference shielded enclosures are electrically coupled to said conduction pattern which is electrically coupled to a ground potential of a system;
• whereby said circuit module can be assembled and individually tested before being mounted over said interposer, and thereby said electromagnetic interference shielded integrated circuit package further enables simplified manufacturing and assembly process by eliminating multiple bulky shield can installations, as well as simplifies inspection and functional testing so as to enable compact and thinner system in package design for a complex electronics system.