Packaged assembly for high density power applications

A packaged assembly comprising:

• a case comprising an aluminum silicon (AlSi) alloy;
• a double-sided substrate disposed on shelves of the case, wherein the double-sided substrate comprises a semiconductor die on a first side of the double-sided substrate coupled to at least one circuit element on a second side of the double-sided substrate;
• and
• a plurality of leads rotatably coupled to the double-sided substrate by a plurality of lead frames allowing each of the plurality of leads to be inverted from a first position to a second position, wherein
• each of the plurality of leads passes through the case and a corresponding one of the plurality of lead frames,
• each of the plurality of leads comprises a substantially 90° bend located outside of the case,
• each of the plurality of leads is rotatable relative to the case about an axis of rotation that is perpendicular to a respective surface of the case through which each of the plurality of leads passes,
• in the first position the substantially 90° bend of each of the plurality of leads is directed toward a top surface of the case, and
• in the second position the substantially 90° bend of each of the plurality of leads is directed toward a bottom surface of the case, the bottom surface being opposite the top surface.

A packaged assembly comprising:

• a package casing;
• a first ledge extending from a first inner sidewall of the package casing;
• a second ledge extending from a second inner sidewall of the package casing, the first inner sidewall facing the second inner sidewall;
• and
• a double-sided dielectric substrate supported by the first ledge and the second ledge, wherein the double-sided dielectric substrate comprises a semiconductor die on a first side of the double-sided dielectric substrate and a capacitor/inductor on a second side of the double-sided dielectric substrate;
• and
• a plurality of leads rotatably coupled to the double-sided dielectric substrate by a plurality of lead frames, wherein
• each of the plurality of leads extends completely through the package casing and a corresponding one of the plurality of lead frames,
• each of the plurality of leads comprises a substantially 90° bend located outside of the package casing, and
• each of the plurality of leads is rotatable relative to the package casing about an axis of rotation that is perpendicular to a respective surface of the package casing through which each of the plurality of leads passes.