Package including multiple semiconductor devices
AssigneeSemiconductor Components Industries, LLC
InventorsJerome Teysseyre, Maria Cristina Estacio, Seungwon Im
Life of this patent
Estimating the term…
Abstract
In a general aspect, an apparatus can include a package including a common gate conductor, a first silicon carbide die having a die gate conductor, and a second silicon carbide die having a die gate conductor. The apparatus can include a first conductive path between the common gate conductor and the die gate conductor of the first silicon carbide die and a second conductive path between the common gate conductor and the die gate conductor of the second silicon carbide die where the first conductive path has a length substantially equal to a length of the second conductive path.
Claims18
An apparatus, comprising:
- a package including:
- a common gate conductor,
- a first semiconductor die having a die gate conductor, and
- a second semiconductor die having a die gate conductor;
- and
- a first conductive path between the common gate conductor and the die gate conductor of the first semiconductor die;
- and
- a second conductive path between the common gate conductor and the die gate conductor of the second semiconductor die,
- the first conductive path having a length substantially equal to a length of the second conductive path.
An apparatus, comprising:
- a first package including a gate metal runner;
- a second package disposed in the first package and including:
- a first silicon carbide die having a gate conductor, and
- a second silicon carbide die having a gate conductor;
- and
- a first conductive path between the gate metal runner and the gate conductor of the first silicon carbide die;
- and
- a second conductive path between the gate metal runner and the gate conductor of the second silicon carbide die,
- the first conductive path having a length substantially equal to a length of the second conductive path.
Dependencies are inferred from the claim text.