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US 10,319,667 B2Granted
Electronic device and method of fabricating the same
AssigneeFujitsu Limited
InventorsShoichi Miyahara, Aki Dote, Hideki Kitada
Life of this patent
Estimating the term…
Abstract
An electronic device includes: a substrate that includes a first penetration hole; a first electrode that is located on a first surface of the substrate so as to cover the first penetration hole; and a first penetrating electrode that is located in the first penetration hole and is in contact with or away from the first electrode depending on temperature.
Claims12
An electronic device comprising:
- a substrate that includes a first penetration hole;
- a first electrode that is formed on a first surface of the substrate and covers the first penetration hole;
- a first penetrating electrode that is formed in the first penetration hole and is in contact with or away from the first electrode depending on temperature;
- a second electrode that is formed on the first surface of the substrate and covers a second penetration hole, the second penetration hole being formed in the substrate and having a diameter greater than a diameter of the first penetration hole;
- a second penetrating electrode that is formed in the second penetration hole and is in contact with the second electrode regardless of the temperature;
- and
- a detection circuit configured to detect whether the first penetrating electrode is in contact with or away from the first electrode.
4 more elements
An electronic device comprising:
- a substrate that includes a first penetration hole;
- a first electrode that is formed on a first surface of the substrate and covers the first penetration hole;
- a first penetrating electrode that is formed in the first penetration hole and is in contact with or away from the first electrode depending on temperature, and
- a detection circuit configured to detect whether the first penetrating electrode is in contact with or away from the first electrode,
- wherein
- the first electrode comprising:
- a first layer, which is to be in contact with the first penetrating electrode, having a melting point greater than a melting point of the first penetrating electrode;
- and
- a second layer being formed on the first layer, having a resistivity lower than a resistivity of the first layer and having a melting point less than a melting point of the first layer.
6 more elements
An electronic device comprising:
- a substrate that includes a first penetration hole;
- a first electrode that is formed on a first surface of the substrate and covers the first penetration hole;
- a first penetrating electrode that is formed in the first penetration hole and is in contact with or away from the first electrode depending on temperature, and
- a detection circuit configured to detect whether the first penetrating electrode is in contact with or away from the first electrode,
- wherein
- a face along which the first electrode and the first penetrating electrode are in contact with each other bends outward so that a center of the face is located further out than the first surface of the substrate.
3 more elements
An electronic device comprising:
- a substrate that includes a first penetration hole;
- a first electrode that is formed on a first surface of the substrate and covers the first penetration hole;
- a first penetrating electrode that is formed in the first penetration hole and is in contact with or away from the first electrode depending on temperature, and
- a detection circuit configured to detect whether the first penetrating electrode is in contact with or away from the first electrode,
- wherein the substrate is an insulating substrate.
2 more elements
Dependencies are inferred from the claim text.