Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device, comprising:

• preparing a stacked body including a base body, an insulating plate disposed on a surface of the base body, a conductor layer formed on a surface of the insulating plate, and a semiconductor element connected to the conductor layer;
• and
• connecting an outer peripheral case body to the stacked body so as to surround an outer periphery of the base body,
• the outer peripheral case body having a plurality of recesses formed therein,
• the plurality of recesses each including an upper end opening that opens at an upper end face of the outer peripheral case body opposite to the base body,
• the outer peripheral case body having inner peripheral side openings formed in an inner peripheral surface of the case body, each side opening continuous with the upper end opening of a respective recess and extending from the upper end face toward the base body and is continuous with the respective recess,
• in a circumferential direction of the outer peripheral case body, each inner peripheral side opening has a width narrower than a width of each recess,
• the method further comprising
• inserting a terminal component through the upper end opening into a first recess of the plurality of recesses,
• the terminal component including:
• a first insertion portion including a first portion inserted into the first recess in a first insertion direction,
• a first external terminal portion which is continuous with the first insertion portion and extends through the upper end opening in the first recess to outside of the outer peripheral case body, and
• a first connection terminal portion, which is continuous with the first insertion portion, includes at least second and third portions, and extends through the inner peripheral side opening of the first recess onto the conductor layer,
• the method further comprising;
• directly connecting the first connection terminal portion and the conductor layer, and
• forming a resin layer at least sealing the semiconductor element and the first connection terminal portion in a region surrounded by the insulating plate and the outer peripheral case body, wherein
• the first portion and the third portion are wider than the second portion from one end to another end of the terminal component in a width direction perpendicular to the insertion direction.