Semiconductor device packages using a thermally enhanced conductive molding compound

A method for packaging an electronic device assembly, the method comprising:

• placing a first electronic device in a first area of a package substrate for the electronic device assembly;
• affixing a thermally conductive structure to a major surface of the first electronic device, wherein
• the thermally conductive structure comprises thermally conductive polymers,
• the thermally conductive polymers are dielectric materials, and
• the thermally conductive structure is affixed at a first end to the first electronic device and is free at a second end of the thermally conductive structure;
• forming an encapsulant over and around sides of the first electronic device and over and around sides of the thermally conductive structure;
• exposing a portion of the thermally conductive polymers at the second end of the thermally conductive structure at a first major surface of the encapsulated electronic device assembly;
• and
• affixing a heat sink to the first major surface of the encapsulated electronic device assembly, wherein
• the heat sink is configured to dissipate heat transported from the first electronic device through the thermally conductive structure, and
• said affixing is performed by applying a thermally conductive adhesive directly to the second end of the thermally conductive structure and the heat sink coupled directly to the thermally conductive adhesive.