Semiconductor package and related methods

A semiconductor package comprising:

• a substrate comprising a first surface and a second surface, the second surface opposing the first surface;
• two or more cutouts positioned in a first edge and in a second edge of the substrate;
• a bushing positioned around a perimeter of each of the two or more cutouts, the bushing coupled on the first surface of the substrate;
• a plurality of pin holders coupled on the first surface of the substrate;
• a plurality of pins slidably coupled into the plurality of pin holders;
• and
• a molding compound at least partially encapsulating the substrate, a side surface of the bushing, and a plurality of side surfaces of the plurality of pin holders.

A semiconductor package comprising:

• a substrate comprising a first side and a second side;
• a hole in the substrate extending from the first side to the second side and positioned in a center of the substrate;
• a bushing around the hole on the first side of the substrate;
• a flange around a first end of the bushing, the first end opposite a second end of the bushing, the second end configured to couple with the substrate;
• a plurality of pin holders arranged and coupled on the substrate;
• a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders.