Electronic component package and method of housing an electronic component

A method of housing an electronic component, comprising:

• preparing a carrier tape that includes a plurality of recesses, each of the recesses including a take-out opening;
• preparing a plurality of electronic components, each of the electronic components including a body having a first main surface convexly curved along a longitudinal direction and a second main surface concavely curved along the longitudinal direction, a distance between the first main surface and the second main surface being 50 μm or less;
• and
• housing the plurality of electronic components respectively in the plurality of recesses such that each first main surface faces toward the take-out opening corresponding thereto;
• and
• covering the take-out openings of the plurality of recesses with a cover tape configured to be capable of being peeled off,
• wherein each electronic component includes a ceramic electronic component,
• wherein the ceramic electronic component includes a multi-layer ceramic electronic component that is made of insulating ceramics and includes a first cover and a second cover, the first cover forming the first main surface, the second cover forming the second main surface,
• wherein an angle formed by tangent lines that are tangent to ends of the first main surface in the longitudinal direction is 170° or more and 176° or less, and an angle formed by a virtual line parallel to the longitudinal direction of the multi-layer ceramic capacitor and the tangent line is 2° or more and 5° or less.