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US 10,319,655 B2Granted
POP structures with dams encircling air gaps and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu, Jiun Yi Wu
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Abstract
A device includes a bottom package component that includes a bottom die, and a dam over a top surface of the bottom die. The dam has a plurality of sides forming a partial ring, with an air gap surrounded by the plurality of side portions. The air gap overlaps the bottom die. A top package component is bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die.
Claims20
A package comprising:
- a bottom die;
- a dam over the bottom die, wherein the dam comprises a plurality of side portions forming a partial ring, and the dam is configured to allow air exchange between an inner space inside the dam and an outer space outside of the dam, and the plurality of side portions comprise:
- a first side portion and a second side portion parallel to each other;
- a third side portion comprising:
- a first lower portion connecting a first end of the first side portion to a first end of the second side portion;
- and
- a first plurality of upper portions separated from each other by first recesses, wherein the first plurality of upper portions and the first recesses overlap the first lower portion.
4 more elements
A package comprising:
- a bottom package comprising:
- a bottom package substrate;
- and
- a bottom device die over and bonded to the bottom package substrate;
- a top package over and bonded to the bottom package substrate, wherein the top package is spaced apart from the bottom device die by an air gap;
- a dam in contact with both the bottom device die and the top package, wherein the dam comprises:
- a first side portion and a second side portion parallel to each other, with each of the first side portion and the second side portion having an outer edge substantially aligned to a respective edge of the bottom device die;
- and
- a third side portion extending from the first side portion to the second side portion, wherein a recess is formed to extend from a top surface to an intermediate level of the third side portion, with the intermediate level being between the top surface and a bottom surface of the third side portion;
- and
- an encapsulating material contacting the outer edges of the first side portion and the second side portion and an outer edge of the third side portion, wherein at least a portion of an inner edge of each of the first side portion, the second side portion, and the third side portion is spaced apart from the encapsulating material.
8 more elements
A package comprising:
- a package substrate;
- a device die over the package substrate, wherein the device die is bonded to the package substrate through flip-chip bonding;
- a dam over and in contact with a top surface of the device die, wherein the dam comprises:
- three side portions adjacent to respective edges of the device die, wherein the three side portions of the dam are interconnected to form a partial ring;
- a recess extending from a top surface of one of the three side portions to an intermediate level of the dam, with the intermediate level being between the top surface and a bottom surface of the one of the three side portions, wherein the recess is configured to allow air exchange between an inner space encircled by the dam and an outer space outside of the dam;
- a top package over and in contact with the dam;
- an encapsulating material contacting outer sidewalls of the dam, with an inner sidewall of the dam spaced apart from the encapsulating material;
- and
- solder regions bonding the top package to the package substrate.
6 more elements
Dependencies are inferred from the claim text.