Semiconductor package with elastic coupler and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsYusheng Lin, Chee Hiong Chew, Francis J. Carney
Life of this patent
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Abstract
Implementations of semiconductor packages may include: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die, wherein the pin includes a reversibly elastically deformable lower portion configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered to be coupled to the substrate.
Claims9
A semiconductor package, comprising:
- a die coupled to a substrate;
- a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and;
- a pin fixedly coupled to the housing and electrically coupled with the die, the pin comprising a reversibly elastically deformable lower portion, the reversibly elastically deformable lower portion coupled with a lower end of the pin;
- wherein the reversibly elastically deformable lower portion is located in the pin between the housing and the substrate;
- and
- wherein the reversibly elastically deformable lower portion is configured to compress to prevent the lower end of the pin from lowering beyond a predetermined point relative to the lower end of the pin when the housing is lowered to be coupled to the substrate.
A semiconductor package, comprising:
- at least one die coupled to a substrate;
- a housing coupled to the substrate and at least partially enclosing the at least one die within a cavity of the housing, and;
- a plurality of pins fixedly coupled in a top of the housing, each of the plurality of pins electrically coupled with one of the at least one die through a connection trace of the substrate, each of the plurality of pins comprising a spring between an upper portion of the pin and a lower portion of the pin;
- wherein the spring of each pin biases an upper portion of the pin towards the housing;
- and
- wherein the spring is located in the pin between the housing and the substrate.
Dependencies are inferred from the claim text.