Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJongyoun Kim, Seokhyun Lee
Life of this patent
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Abstract
A semiconductor package including a redistribution substrate, and a semiconductor chip mounted on the redistribution substrate, the semiconductor chip having a conductive pad on one surface thereof may be provided. The redistribution substrate may include a first passivation pattern on the conductive pad, the first passivation pattern exposing a portion of the conductive pad, and a redistribution pattern covering the portion of the conductive pad exposed by the first passivation pattern and surrounding the first passivation pattern.
Claims17
A semiconductor package comprising:
- a redistribution substrate;
- and
- a semiconductor chip mounted on the redistribution substrate, the semiconductor chip having a conductive pad on one surface thereof,
- wherein the redistribution substrate comprises,
- a first passivation pattern on the conductive pad, the first passivation pattern exposing a portion of the conductive pad,
- a second passivation pattern outside the first passivation pattern on the one surface, the second passivation pattern laterally spaced apart from the first passivation pattern,
- a redistribution pattern covering the portion of the conductive pad exposed by the first passivation pattern and surrounding the first passivation pattern,
- wherein a level of the first passivation pattern is same as a level of the second passivation pattern.
A semiconductor package comprising:
- a substrate including a first conductive pad on one surface thereof;
- and
- a semiconductor chip on the substrate, the semiconductor chip including a second conductive pad on one surface thereof,
- wherein the substrate further comprises,
- a redistribution pattern electrically connecting the first conductive pad to the second conductive pad, and
- a first passivation pattern and a second passivation pattern on the second conductive pad, the first and second passivation patterns laterally spaced apart from each other, the redistribution pattern covering the first passivation pattern.
A semiconductor package comprising:
- a semiconductor chip having a conductive pad on one surface thereof;
- and
- a redistribution substrate having the semiconductor chip thereon, the redistribution substrate including,
- a first passivation pattern covering a first portion of the conductive pad, and
- a redistribution pattern covering a second portion of the conductive pad that is exposed by the first passivation pattern, and surrounding an outside of the first passivation pattern,
- wherein the first passivation pattern covers an edge region and a sidewall of the conductive pad and a surface of the redistribution substrate exposed by the conductive pad.
Dependencies are inferred from the claim text.