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US 10,319,619 B2Granted
Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package components
AssigneeSamsung Electronics Co., Ltd.
InventorsBongJin Son, Yose Eum, JangWoo Lee
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Abstract
Provided are an apparatus for manufacturing a semiconductor device and a method of manufacturing a semiconductor package using the same. The manufacturing apparatus may include a base with a plurality of through holes and weight blocks respectively bound by the through holes.
Claims12
An apparatus for manufacturing a semiconductor device, comprising:
- a base with a plurality of through holes;
- and
- weight blocks bound by the through holes, respectively, the weight blocks being configured to apply pressure to a surface of the semiconductor device during a reflow process, the weight blocks being configured to be vertically movable in corresponding through holes;
- wherein each of the weight blocks comprises:
- a lower part configured to be vertically movable in a corresponding one of the through holes;
- and
- an upper part extending from the lower part;
- wherein the lower part has a vertical length that is greater than a length of the corresponding one of the through holes.
5 more elements
A method of manufacturing a semiconductor package, comprising:
- preparing first packages, each of which comprises first connection patterns;
- disposing second packages on the first packages, respectively, each of the second packages comprising second connection patterns at positions corresponding to the first connection patterns;
- disposing a base with weight blocks, on the second packages wherein each of the weight blocks comprises a lower part configured to be vertically movable in a corresponding one of the through holes, and an upper part extending from the lower part wherein the lower part has a vertical length that is greater than a length of the corresponding one of the through holes, and a bottom surface of each of the weight blocks having a protrusion;
- applying a pressure to all of the second packages using the weight blocks;
- and
- performing a reflow process on the first and second connection patterns to form a connection structure electrically connecting the first and second packages to each other.
3 more elements
Dependencies are inferred from the claim text.