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US 10,319,618 B2Granted
Metal recycling method and metal recycling equipment thereof
AssigneeEpistar Corporation
InventorsChun-Lung Tseng, Hung-Yao Lin, Hsin-Yi Wang, Chin-Kang Hu, Sheng-Hsiung Chuang
Life of this patent
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Abstract
A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.
Claims19
A metal recycling method, which comprises:
- attaching a tape to a metal layer of a semiconductor structure, and wherein the metal layer comprises gold, silver, platinum, aluminum or copper;
- and
- providing a first pressure difference to separate a part of the metal layer from the semiconductor structure and transfer the part of the metal layer to the tape.
Dependencies are inferred from the claim text.