Package structure and method therof

A package structure, comprising:

• a) a substrate having opposite first and second surfaces;
• b) a die having opposite active and back surfaces, wherein said die is arranged above said first surface of said substrate, said back surface of said die is adjacent to said first surface of said substrate;
• c) pads arranged on said active surface of said die;
• d) a first encapsulator encapsulating said die to expose a portion of said pads;
• e) an interconnection structure arranged on said first encapsulator and said pads, and being electrically connected to said pads;
• f) a second encapsulator encapsulating said interconnection structure to expose a portion of said interconnection structure;
• g) a redistribution structure configured as a patterned conductive metal layer arranged on said second encapsulator and said interconnection structure to form a pin layer on a first surface of said package structure to directly provide external electrical connectivity;
• h) a throughout channel structure extending from said first surface of said package structure to a second surface of said package structure that is opposite to said first surface of said package structure;
• and
• i) a back patterned metal layer arranged on said second surface of said package structure and connected to said throughout channel structure to form a heat dissipation layer, wherein said back patterned metal layer has only horizontal components and is electrically isolated from said back surface of said die, and wherein said back patterned metal layer is electrically isolated from said pads on said die.