Package-on-package structure with organic interposer

A device comprising:

• a lower substrate having a die disposed on a first side of the lower substrate;
• first pillars disposed on the first side of the lower substrate, the first pillars comprising a first conductive material, wherein the first pillars have a first pitch;
• a moldable underfill (MUF) disposed on the first side of the lower substrate, the MUF comprising a substantially continuous distribution of MUF material over and adjacent the die, wherein the MUF surrounds the die and each of the first pillars;
• a solder resist layer between the lower substrate and a portion of the MUF, the first pillars extending through the solder resist layer, wherein a lowermost surface of the MUF is closer to the first side of the lower substrate than an uppermost surface of the solder resist layer;
• an interposer mounted over the first side of the lower substrate, the interposer comprising:
• an organic substrate having a first side and a second side opposite the first side;
• a first redistribution layer on the first side of the organic substrate, the first redistribution layer comprising lands, wherein the lands have a second pitch greater than the first pitch, and wherein at least one of the lands is aligned directly over the die, the first redistribution layer configured for mounting an overlying package, the overlying package comprising an upper substrate;
• a second redistribution layer on the second side of the organic substrate, wherein a top surface of the MUF is in contact with the second redistribution layer;
• vias extending through the organic substrate and electrically connecting the first redistribution layer to the second redistribution layer;
• and
• second pillars disposed on the second redistribution layer, the second pillars comprising the first conductive material;
• conductive connectors bonding the first pillars to the second pillars and providing electrical connectivity between the interposer and the lower substrate, the conductive connectors comprising a second conductive material different from the first conductive material, wherein the second pillars contact the second redistribution layer, and wherein the MUF comprises a single layer of material which surrounds and contacts sidewalls of the first pillars, the second pillars, and the conductive connectors;
• and
• a die attach film extending between a top surface of the die and a bottom surface of the second redistribution layer, the die attach film comprising a material different from the material of the MUF, the die attach film having a width equal to a width of the die, the die attach film contacting the die, the second redistribution layer, and the MUF.

A device comprising:

• a die mounted on a first side of a substrate;
• a moldable underfill (MUF) disposed on the first side of the substrate, the MUF comprising a continuous distribution of MUF material laterally adjoining the die, an upper most surface of the die being free from the MUF material;
• an interposer mounted on the first side of the substrate, the interposer comprising:
• an organic substrate having a first side and a second side opposite the first side;
• a first redistribution layer on the first side of the organic substrate, the first redistribution layer comprising lands disposed on the first redistribution layer;
• a second redistribution layer on the second side of the organic substrate, the interposer mounted to the substrate by connectors bonded to the second redistribution layer, the connectors providing electrical connectivity between the interposer and the substrate, the connectors having a first spacing between adjacent connectors, the lands having a second spacing between adjacent lands, wherein the connectors comprise first pillars disposed on the first side of the substrate, second pillars disposed on the second side of the organic substrate, and connecting members bonding each of the first pillars to a respective one of the second pillars, wherein the connecting members are a different conductive material than the first pillars and the second pillars, wherein the MUF comprises a single layer contacting the first pillars, the second pillars, and the connecting members;
• and
• vias extending through the organic substrate and electrically connecting the first redistribution layer to the second redistribution layer;
• a die attach film extending from the upper most surface of the die to the second redistribution layer, the die attach film comprising a different material from the MUF, the MUF extending along and contacting opposite sidewalls of the die attach film;
• and
• a package mounted on the first side of the interposer and electrically connected to the lands, wherein at least one of the lands is directly over the die, wherein the first spacing is different than the second spacing.