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AssigneeXilinx, Inc.
InventorsJaspreet Singh Gandhi, Tien-Yu Lee, Henley Liu, Ivor G. Barber, Suresh Ramalingam
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An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is provided that includes a package substrate having a plurality of solder balls coupled to a plurality of contact pads. The package substrate includes a solder mask having a plurality of stepped openings, a plurality of contact pads, and circuitry disposed in the package substrate and coupled to the plurality of contact pads. The solder mask defines a top side of the package substrate. The stepped openings expose the contact pads through solder mask.
An integrated circuit interconnect comprising:
A method for forming an interconnect of an integrated circuit package, the method comprising:
A package structure comprising:
Dependencies are inferred from the claim text.