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US 10,319,601 B2Granted
Slurry for polishing of integrated circuit packaging
AssigneeApplied Materials, Inc.
InventorsRanga Rao Arnepalli, Prerna Goradia, Prayudi Lianto, Jie Zeng, Arvind Sundarrajan, Robert Jan Visser, Guan Huei See
Life of this patent
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Abstract
A slurry for chemical mechanical planarization includes water, 1-3 wt. % of abrasive particles having an average diameter of at least 10 nm and less than 100 nm and an outer surface of ceria, and ½-3 wt. % of at least one amine.
Claims15
A method of fabricating packaging for an integrated circuit chip, comprising:
- bringing an outer polymer layer of a workpiece into contact with a polishing pad, wherein the outer polymer layer is polybenzobisoxazole (PBO);
- supply a slurry to an interface between the workpiece and the polishing pad, wherein the slurry comprises water, 1-3 wt. % of abrasive particles having an average diameter of at least 20 nm and less than 100 nm and having an outer surface of ceria, and ½-3 wt. % of at least one amine, wherein the slurry consists of water, the abrasive particles and the at least one amine;
- and
- generating relative motion between the workpiece and the polishing pad to polish the outer polymer layer.
1 more element
A method of fabricating packaging for an integrated circuit chip, comprising:
- bringing an outer polymer layer of a workpiece into contact with a polishing pad, wherein the outer polymer layer is polybenzobisoxazole (PBO);
- supply a slurry to an interface between the workpiece and the polishing pad, wherein the slurry comprises water, 1-3 wt. % of abrasive particles having an average diameter of at least 20 nm and less than 100 nm and having an outer surface of ceria, ½-3 wt. % of at least one amine, and 0.5-1.5 wt. %, of tetramethylammonium hydroxide (TMAH), wherein the slurry consists of the water, the abrasive particles, the at least one amine, and the TMAH;
- and
- generating relative motion between the workpiece and the polishing pad to polish the outer polymer layer.
1 more element
Dependencies are inferred from the claim text.