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US 10,319,530 B2Granted
Electronic component and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJae Young Na
Life of this patent
Estimating the term…
Abstract
An electronic component is provided to include: a capacitor array having a structure in which a plurality of capacitors are arranged; a pair of metal frames disposed on side surfaces of the capacitor array, connected to external electrodes of the plurality of capacitors, and including penetration portions formed in positions in which the pair of metal frames are connected to the external electrodes; and a plating member filling the penetration portions. A manufacturing method thereof is further provided.
Claims8
An electronic component comprising:
- a capacitor array having a structure in which a plurality of capacitors are arranged;
- a pair of metal frames disposed on side surfaces of the capacitor array, connected to external electrodes of the plurality of capacitors, and including penetration portions formed in positions in which the pair of metal frames are connected to the external electrodes;
- and
- a plating member filling the penetration portions,
- wherein the plating member is disposed on exposed portions of the pair of metal frames that are exposed to outside.
2 more elements
Dependencies are inferred from the claim text.