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US 10,319,525 B2Granted
Multi-layer ceramic capacitor assembly
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSoon-Ju Lee, Young-Ghyu Ahn, Kyoung-Jin Jun, Sang-Soo Park, So-Yeon Song, Heung-Kil Park
Life of this patent
Estimating the term…
Abstract
A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.
Claims2
A multi-layer ceramic capacitor assembly comprising:
- a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate;
- an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes;
- a circuit board having surface electrodes formed on one surface thereof and being coupled to the electrode-forming substrate in such a way that the surface electrodes are electrically connected with the external electrodes through the through-holes;
- and
- a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate,
- wherein a physical coupling between the multi-layer ceramic capacitor and the electrode-forming substrate is made in a region in which the external electrodes are not formed, and a physical coupling between the electrode-forming substrate and the circuit board is made in a region in which the external electrodes are formed,
- wherein the electrode-forming substrate comprises current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes,
- wherein each of the current-carrying soldering members comprises a first portion displaced in the through-holes, and a second portion displaced between the first portion and one of the surface electrodes, and
- wherein a horizontal width of the second portion is longer than a horizontal width of the first portion, and shorter than a horizontal width of one of the surface electrodes.
6 more elements
A multi-layer ceramic capacitor assembly comprising:
- a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate;
- an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes;
- a circuit board having surface electrodes formed on one surface thereof and being coupled to the electrode-forming substrate in such a way that the surface electrodes are electrically connected with the external electrodes through the through-holes;
- and
- a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate,
- wherein the first bonding part comprises:
- a pair of first bonding pads formed integrally with the multi-layer ceramic capacitor and the electrode-forming substrate, respectively;
- and
- a first soldering member configured for soldering the pair of first bonding pads with each other,
- wherein the electrode-forming substrate comprises current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes,
- wherein each of the current-carrying soldering members comprises a first portion displaced in the through-holes, and a second portion displaced between the first portion and one of the surface electrodes, and
- wherein a horizontal width of the second portion is longer than a horizontal width of the first portion, and shorter than a horizontal width of one of the surface electrodes.
9 more elements
Dependencies are inferred from the claim text.