Conductor-insulator-conductor capacitor and method of fabricating the same

A conductor-insulator-conductor capacitor, comprising:

• an inner electrode;
• an outer electrode, having a stepped shape, surrounding and encapsulating a top surface, a bottom surface and a sidewall of the inner electrode and comprising:
• a bottom part, located below the inner electrode;
• a top part, located above the inner electrode;
• and
• a stepped structure, located aside the inner electrode and connected to the bottom part and the top part;
• and
• an intermediate dielectric layer, located between the inner electrode and the outer electrode and surrounding the inner electrode, such that the inner electrode is electrically isolated from the outer electrode.

A method of fabricating a conductor-insulator-conductor capacitor, comprising:

• forming a first conductive material layer above a substrate;
• forming a first insulating material layer on the first conductive material layer;
• forming a second conductive material layer on the first insulating material layer;
• patterning the second conductive material layer to form a second conductive layer;
• forming a second insulating layer, wherein the second insulating layer covers a top surface and a sidewall of the second conductive layer;
• patterning the first insulating material layer and the first conductive material layer to form a first insulating layer and a first conductive layer;
• forming a third conductive material layer, wherein the third conductive layer covers a sidewall of the second insulating layer and a sidewall of the first conductive layer, and is in physical contact with and electrically connected to the first conductive layer;
• and
• patterning the third conductive material layer to form a third conductive layer,
• wherein an area of the second conductive layer is less than an area of the first conductive layer, such that the third conductive layer is formed in a stepped shape and comprises:
• a stepped structure, located aside the first conductive layer and the second conductive layer and comprising, from bottom to top, a first stepped portion and a second stepped portion;
• and
• a top part, located above the second conductive layer and electrically connected to the second stepped portion of the stepped structure.