Camera module and electronic device
AssigneeSony Corporation
InventorsToshihide Ueno, Tomomi Kume, Masahiko Shimizu
Life of this patent
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Abstract
The present invention relates to a camera module in which a thin camera module can be realized at a low cost and an electronic device. The camera module includes a lens unit that stores a lens that condenses light on a light receiving surface of an image sensor; a rigid substrate on which the image sensor is disposed; and a flexible substrate electrically connected with the rigid substrate, wherein in the case where the light receiving surface of the image sensor locates at the top, the lens unit, the flexible substrate, and the rigid substrate are disposed in this order from the top.
Claims20
A camera module, comprising:
- a lens unit that includes a lens, wherein the lens is configured to condense light on a light receiving surface of an image sensor;
- a rigid substrate, wherein the image sensor is on the rigid substrate;
- a flexible substrate electrically connected to the rigid substrate;
- a first electrode pad of the image sensor;
- and
- an embedded electrode embedded in the flexible substrate,
- wherein the embedded electrode is connected to the first electrode pad,
- wherein the light receiving surface of the image sensor faces the lens unit,
- wherein the lens unit, the flexible substrate, and the rigid substrate are arranged in this order from a side of the lens unit;
- and
- wherein, in the rigid substrate of a square shape, a solder resist is absent in a band-shaped region that has a specified distance from an end of one side of the rigid substrate.
A method for manufacturing a camera module, the method comprising:
- connecting a flexible substrate with a rigid substrate;
- and
- placing a lens unit on the rigid substrate,
- wherein the lens unit includes a lens configured to condense light on a light receiving surface of an image sensor,
- wherein in an overlap region of a band shape having a specified distance from an end of one side of the rigid substrate, the rigid substrate overlaps a portion of the flexible substrate and the rigid substrate is attached to the flexible substrate,
- wherein, in the rigid substrate of a square shape, a solder resist is absent in the overlap region of the band shape, and
- wherein an electrode pad of the image sensor is connected to an embedded electrode embedded in the flexible substrate.
An electronic device, comprising:
- a camera module including:
- a lens unit that includes a lens, wherein the lens is configured to condense light on a light receiving surface of an image sensor;
- a rigid substrate, wherein the image sensor is on the rigid substrate;
- a flexible substrate electrically connected to the rigid substrate;
- an electrode pad of the image sensor;
- and
- an embedded electrode embedded in the flexible substrate,
- wherein the embedded electrode is connected to the electrode pad,
- wherein the light receiving surface of the image sensor faces the lens unit,
- wherein the lens unit, the flexible substrate, and the rigid substrate are arranged in this order from a side of the lens unit;
- and
- wherein, in the rigid substrate of a square shape, a solder resist is absent in a band-shaped region that has a specified distance from an end of one side of the rigid substrate.
Dependencies are inferred from the claim text.