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US 10,312,604 B2Granted
Crimping terminal and electric wire with crimping terminal
AssigneeHitachi Metals, Ltd.
InventorsKazufumi Suenaga, Setsuo Ando, Hisashi Tate, Yuju Endo
Life of this patent
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Abstract
A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.
Claims9
A crimping terminal, comprising:
- a crimping part that is compressed to a conductive part of an electric wire;
- and
- a buffer layer formed on a surface where the crimping part contacts the conductive part,
- wherein the buffer layer comprises a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein,
- wherein the microscopic particle comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle,
- wherein the crimping part comprises a flat surface,
- wherein a tip curvature diameter of the fine protrusion arranged on a surface of the microscopic particle is not less than 0.0006% of a radius of the microscopic particle and not more than 10% of the radius of the microscopic particle,
- wherein a height of the fine protrusion arranged on the surface of the microscopic particle is less than 0.5% of a diameter of the microscopic particle, and
- wherein the microscopic particle comprises Ni including P.
6 more elements
An electric wire with a crimping terminal, comprising:
- an electric wire comprising a conductive part;
- and
- a crimping terminal comprising a crimping part that is compressed to the conductive part of the electric wire,
- wherein a buffer layer comprising a resin, a plating or a grease that is interposed in a contact interface between the conductive part and the crimping part,
- wherein a conductive microscopic particle that comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle is mixed and dispersed in the buffer layer,
- wherein the microscopic particle in the buffer layer pierces an insulating coat on a surface of the conductive part and contacts the conductive part,
- wherein the crimping part comprises a flat surface,
- wherein a tip curvature diameter of the fine protrusion arranged on the surface of the microscopic particle is not less than 0.0006% of a radius of the microscopic particle and not more than 10% of the radius of the microscopic particle,
- wherein a height of the fine protrusion arranged on the surface of the microscopic particle is less than 0.5% of a diameter of the microscopic particle, and
- wherein the microscopic particle comprises Ni including P.
7 more elements
Dependencies are inferred from the claim text.