Fixing structure and fixing method
AssigneeJapan Aviation Electronics Industry, Limited
InventorsTakushi Yoshida, Hiroshi Akimoto, Yosuke Seki
Life of this patent
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Abstract
A fixing method for fixing a terminal to a conductive pattern with a brazing filler metal disposed therebetween includes: a first step of disposing the brazing filler metal on the conductive pattern; a second step of bringing the terminal into contact with the brazing filler metal; and a third step of forming a penetrating hole in the terminal by irradiating a laser beam onto the terminal. In the third step, the laser beam is irradiated onto the terminal in such a manner that the penetrating hole is filled with the brazing filler metal melted by the irradiation of the laser beam.
Claims10
A fixing structure comprising:
- a substrate;
- a conductive pattern formed on the substrate;
- an adhesive layer formed of a brazing filler metal;
- and
- a terminal, the terminal being fixed to the conductive pattern by the adhesive layer,
- wherein a penetrating hole is formed in the terminal, the penetrating hole being gradually widened in a direction away from the substrate toward an upper surface of a fixed portion of the terminal,
- the penetrating hole is filled with the brazing filler metal, and
- the brazing filler metal is a solder.
A fixing structure comprising:
- a wire including a conductor;
- a brazing filler metal wetting the conductor;
- and
- a terminal, the terminal being fixed to the conductor by the brazing filler metal,
- wherein a penetrating hole is formed in the terminal, the penetrating hole being gradually widened in a direction toward an upper surface of a fixed portion of the terminal,
- the penetrating hole is filled with the brazing filler metal, and
- the brazing filler metal is a solder.
Dependencies are inferred from the claim text.